42.50 40.00 (x4) 1.00 typ. top view 1.5875 2.87 0.51 2 3 1 proprietary and confidential - the information contained in this drawing is the sole property of ironwood electronics, inc. any reproduction in part or as a whole without the written permission of ironwood electronics, inc. is prohibited. u.s. patent no. 8,091,222 b2 side view top iso view bottom iso view item no. description material 1 sf pin substrate fr4 high temp 2 p-s519a, socket pin, 1.0mm centers minimum, #4 clip body - gold plated brass 360, clip - gold plated beryllium copper 172 3 solder ball, rohs compliant 0.024" dia sn96.5 ag3.0 cu0.5 ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: sf-bga 42.5mm 41x41 array 1mm pitch primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: released rev. a date: 04/16/2015 material: n/a finish: n/a weight: 8.17 SF-BGA1309A-B-42F drawing scale: 2:1 sheet: 1 of 1 eng: e. smolentseva file: SF-BGA1309A-B-42F dwg drawn by: m. raske
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